Applied Materials has announced the acquisition of NEXX from ASMPT Limited. The deal strengthens Applied Materials’ capabilities in advanced packaging technology and supports the growing demand for AI chips, high-performance computing, and next-generation semiconductor solutions.
The acquisition of NEXX, a leading provider of advanced packaging deposition equipment, enhances Applied Materials’ portfolio of panel-level packaging technologies. These solutions are critical for enabling chipmakers to build larger, more powerful AI accelerators with improved energy efficiency and performance.
As artificial intelligence workloads continue to grow, semiconductor companies are increasingly adopting chiplet-based architectures, integrating GPUs, high-bandwidth memory (HBM), and input-output components into a single package. This shift toward 2.5D and 3D chip stacking technologies is driving demand for larger substrates and advanced interposers, accelerating the transition from traditional 300mm wafers to panel-based manufacturing.
Applied Materials has already established leadership in semiconductor fabrication technologies, including digital lithography, physical vapor deposition (PVD), chemical vapor deposition (CVD), and advanced etch and inspection systems. With the addition of NEXX’s electrochemical deposition (ECD) technology, the company can deliver more comprehensive, co-optimized semiconductor manufacturing solutions for fine-pitch interconnects and high-density packaging.
“Having NEXX join Applied Materials complements our leadership in advanced packaging, particularly in panel processing – an area where we see tremendous opportunities for customer co-innovation and growth in the years ahead. We look forward to welcoming NEXX’s talented team to Applied and collaborating with our combined customer base on this exciting new chapter in advanced packaging technology,” said Dr. Prabu Raja, President of the Semiconductor Products Group at Applied Materials.
“We are excited for NEXX to be a part of Applied Materials because together, we can accelerate the computing industry’s adoption of large-format advanced packaging technologies. NEXX’s products are already strong, and we intend to build on our success as part of Applied Materials with a continued focus on innovation, quality and excellent customer service,” said Jarek Pisera, President of ASMPT NEXX.
This strategic acquisition enables Applied Materials to expand its addressable market in advanced semiconductor packaging, while accelerating innovation in AI chip manufacturing and data center processors. The combined capabilities will help customers develop larger, more complex chips that support machine learning, cloud computing, and high-speed data processing applications.
Industry demand for AI infrastructure, high-performance computing (HPC), and advanced semiconductor packaging is rising rapidly, making panel-level packaging a key enabler of future chip design. By integrating NEXX’s expertise, Applied Materials is well-positioned to support the evolving needs of semiconductor manufacturers and system companies.
The transaction is expected to close in the coming months, after which the NEXX team will join Applied Materials’ Semiconductor Products Group. This move reinforces the company’s commitment to driving innovation in semiconductor technology, AI hardware, and next-generation chip manufacturing.
